U.S. federal trademark · Serial No. 86614344 · Reg. No. 4971895
Manufacture of box build or system assemblies, printed wire board assemblies, interconnect and cable assemblies, RF and microwave integrated circuits, hybrid microelectronics, LTCC/HTCC substrate and packages, aluminum nitride ceramic substrates and packages, thick film substrates for use in enhanced circuits processing, and Thin Film ceramic substrates, to order and/or specification of others in the defense, aerospace, medical, optoelectronics, space, telecommunications, and commercial industries; assembly of microelectronics and circuit cards for others
Design and development for others of application-specific electronic interface hardware for use in defense, aerospace, medical, optoelectronics, space, telecommunications, and commercial industries
Source: USPTO federal trademark records. Informational only, not legal advice. Status and details may lag the live USPTO database.