Grinding, polishing, and lapping machines for manufacturing semiconductors and photonics, optical and telecommunication components, and for semiconductor wafer-thinning; grinding, polishing, and lapping machines for the purpose of grinding, polishing, and lapping materials such as lenses, semiconductor wafers, fine metal, glass, plastic, or ceramic materials

'ceram':45 'compon':14 'fine':40 'glass':42 'grind':1,21,30 'lap':4,24,33 'lens':37 'machin':5,25 'manufactur':7 'materi':34,46 'metal':41 'optic':11 'photon':10 'plastic':43 'polish':2,22,31 'purpos':28 'semiconductor':8,17,38 'telecommun':13 'thin':20 'wafer':19,39 'wafer-thin':18

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