U.S. federal trademark · Serial No. 88233349 · Reg. No. 6667137
chemicals and electroplating chemicals for use in semiconductor manufacture, semiconductor device fabrication, and semiconductor packaging; chemicals and electroplating chemicals for wafer level semiconductor packaging processes; chemicals and electroplating chemicals for panel level semiconductor packaging processes; chemicals and electroplating chemicals for fan out wafer level semiconductor packaging processes; chemicals and electroplating chemicals for fan out panel level semiconductor packaging processes
Source: USPTO federal trademark records. Informational only, not legal advice. Status and details may lag the live USPTO database.