U.S. federal trademark · Serial No. 98543857
Prefabricated building for high-performance computing (HPC) operations made substantially of metal.
Direct-to-chip cooling systems for high-performance computing (HPC) systems for use inside data centers for use in cooling computer equipment, namely liquid cooling systems and air cooling systems; Smart electric power distribution units (PDU); Power distribution system for modular computer components for use in high-performance computing (HPC) operations; Power distribution system consisting of electric cables, electric switches, electric breakers, electric control panel; electric relays; electric connectors; electric connector housings; electric transformers.
Liquid immersion cooling systems comprised of liquid baths and air-cooled heat exchangers for computer components for use in high-performance computing (HPC) operations.
Source: USPTO federal trademark records. Informational only, not legal advice. Status and details may lag the live USPTO database.