U.S. federal trademark · Serial No. 72219989 · Reg. No. 0808858
PLASTICIZED THERMOSETTING CHEMICAL COMPOSITION HAVING A CONDUCTIVE METAL BASE AND A BONDING CONSTITUENT SUCH AS SILVER EPOXIDE, FOR SOLDERING METAL-TO-METAL, OR METAL-TO-NONCONDUCTIVE MATERIALS IN SEMICONDUCTOR DIODES, RECTIFIERS, TRANSISTORS, AND INTEGRATED CIRCUITS
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