computer program for use with a device for measuring parameters of semiconductor wafers, including metal thickness and deposit monitoring, noncontact resistivity monitoring, grain structure monitoring, dielectric film thickness and RIE/plasma etch damage minimization

'comput':1 'damag':32 'deposit':18 'devic':7 'dielectr':26 'etch':31 'film':27 'grain':23 'includ':14 'measur':9 'metal':15 'minim':33 'monitor':19,22,25 'noncontact':20 'paramet':10 'program':2 'resist':21 'rie/plasma':30 'semiconductor':12 'structur':24 'thick':16,28 'use':4 'wafer':13

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