U.S. federal trademark · Serial No. 76242261 · Reg. No. 2597606
METALLIZED CERAMIC SUBSTRATES, NAMELY, PLATED COPPER ON THICK FILM ELECTRONIC SUBSTRATES FOR USE IN THE FURTHER MANUFACTURE OF ELECTRICAL TELECOMMUNICATION, MICROWAVE, [ DATA TRANSLATION,] POWER, BIOMEDICAL EQUIPMENT, NAMELY, RF POWER AMPLIFIERS, WIRELESS COMMUNICATORS, MICROWAVE MODULES, SWITCHES, CONVERTERS, AND CHIP CARRIERS
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