Metal plating chemical compositions for direct depositing of non-conductive surfaces in palladium-based processes; metal plating chemical compositions for electroplating, especially for direct depositing of non-conductive surfaces in palladium based processes; metal plating chemical compositions for electroplating containing palladium compounds, especially organic additives, inorganic additives, and palladium compounds

'addit':48,50 'base':16,35 'chemic':3,20,39 'composit':4,21,40 'compound':45,53 'conduct':11,31 'contain':43 'deposit':7,27 'direct':6,26 'electropl':23,42 'especi':24,46 'inorgan':49 'metal':1,18,37 'non':10,30 'non-conduct':9,29 'organ':47 'palladium':15,34,44,52 'palladium-bas':14 'plate':2,19,38 'process':17,36 'surfac':12,32

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