U.S. federal trademark · Serial No. 86809057 · Reg. No. 5130176
[ Photo-patternable adhesive or film for use in bonding applications in the fields of integrated circuit devices, compound semiconductor devices, microelectromechanical devices, microcircuits, information displays, circuited devices, microfluidic arrays, surface acoustic wave filters, ink jet cartridges and other devices; photo-patternable adhesive or film for wafer or substrate bonding ]
Chemicals for use in bonding applications in the fields of integrated circuit devices, compound semiconductor devices, microelectromechanical devices, microcircuits, information displays, circuited devices, microfluidic arrays, surface acoustic wave filters, ink jet cartridges and other devices; adhesive chemicals and substances for use in wafer or substrate bonding; photoresists; electronic material, namely, solvent type or aqueous type processing compositions for use in the electronics industry
Source: USPTO federal trademark records. Informational only, not legal advice. Status and details may lag the live USPTO database.