U.S. federal trademark · Serial No. 79372134 · Reg. No. 7741401
Photonic chips; integrated circuits, including photonic integrated circuits (PICs); semiconductor chips; data processing equipment and data carriers, namely, blank optical data carriers; microcontrollers; devices enabling the transfer of data; electronic display interfaces for connecting chips; lasers, not for medical purposes; electronic and photonic wires for chips and integrated circuits; electric, temperature sensors, also in the form of photonic chips; optical apparatus, devices and instruments, namely, optical cables and readers; optical semiconductor chips, optical printed circuits and semiconductors; optical fiber arrays and fibre optic cables; spot size converters (SSCs) being photovoltaic converters; scientific, research, navigation, surveying, photographic, cinematographic, audiovisual, optical, weighing, measuring, signalling, detecting, testing, inspecting, life-saving and teaching apparatus and instruments, namely, scientific cameras and optical lenses; apparatus and instruments for conducting, switching, transforming, accumulating, regulating or controlling the distribution or use of photonic instruments, namely, photovoltaic modules and cells; photonic packaging, namely, housings particularly fitted for photonic microchips, photonic test systems comprised of photonic microchips and sensor chips for scientific use, and photonic instruments, namely, photonic microchips, photonic modules; modular photonic test system, namely, temperature sensors and photovoltaic cells; operating systems for photonic test systems, namely, downloadable operating system programs for photonic test systems.
Financial affairs, namely, financial advice and consultancy; financial investment advisory services; investment management; investment consultancy
Treatment of materials, namely, custom assembly of photonic devices and components in specific applications and modules; custom assembly services concerning photonic devices and instruments for and on behalf of third parties; custom manufacturing services in the field of photonic components and devices, including integrated circuits (PICs); hybrid multi-chip custom assembly and integrated circuits polishing of PICs; custom manufacturing of fiber arrays; custom assembling of optical fiber arrays for photonic integrated circuits (PICs); custom assembly services concerning semiconductors, photonic chips and integrated circuits, including photonic integrated circuits (PICs)
Business management; office administration services; business management assistance
Scientific and technological services, namely, analysis and testing in the field of photonic materials and research and design relating thereto; industrial analysis and industrial research services in the field of photonic devices and materials; technical research and engineering services in the field of photonics; design and development services concerning semiconductors, photonic chips and integrated circuits, including photonic integrated circuits (PICs); photonic devices and materials product design services; engineering services concerning the manufacture of PIC enabled modules; scientific and technical consultancy services concerning photonic technology solutions and photonic technology appliances; computer programming services; scientific and technical services concerning the evaluation, testing, design, development, assembly and application of photonic chips, integrated circuits, photonic interfaces and semiconductors; technological consultancy and design services concerning the integration of PICs into devices and the connection of same with other components such as optical fibers, amplifiers, electronics; developing technology related to packaging and housing solutions for photonic integrated circuits (PICs)
Source: USPTO federal trademark records. Informational only, not legal advice. Status and details may lag the live USPTO database.