PLATERA

Owner

Goods & Services

Sensors and measuring instruments for monitoring and measuring the operation, condition, and performance of electrochemical plating (ECP), substrate cleaning, and surface preparation machines used in semiconductor manufacturing and advanced semiconductor packaging; downloadable computer software for controlling and operating electrochemical plating (ECP), substrate cleaning, and surface preparation machines, and for equipment monitoring, data acquisition, diagnostics, plating bath monitoring, process analytics, defect classification, yield analysis, and process optimization in semiconductor manufacturing and advanced semiconductor packaging

Semiconductor manufacturing machines, namely, electrochemical plating (ECP) machines, substrate cleaning machines, and surface preparation machines for processing substrate, all for use in semiconductor manufacturing and advanced semiconductor packaging and structural parts and fittings therefor; Semiconductor manufacturing machines and apparatus incorporating artificial intelligence-powered automation systems for optimizing equipment operation and production scheduling.