MULTILAYER LAMINATES COMPRISING AT LEAST ONE POLYMERIC DIELECTRIC LAYER ON AT LEAST ONE ELECTRICALLY CONDUCTIVE METAL LAYER FOR USE IN MANUFACTURING CIRCUIT BOARDS, CHIP PACKAGING MODULES, SEMICONDUCTOR CARRIERS, AND ELECTRONIC INTERCONNECTIONS

'board':23 'carrier':28 'chip':24 'circuit':22 'compris':3 'conduct':15 'dielectr':8 'electr':14 'electron':30 'interconnect':31 'lamin':2 'layer':9,17 'least':5,12 'manufactur':21 'metal':16 'modul':26 'multilay':1 'one':6,13 'packag':25 'polymer':7 'semiconductor':27 'use':19

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