Chemicals used in industry and science, namely, epoxy adhesives and potting compounds; adhesives used in general industry, thermally conductive adhesives, all used in general industry; thermal interface materials for use in industry and science, namely, thermally conductive adhesives for establishing force-fit thermal connections and thermally conductive pastes and gap fillers for establishing removable thermal connections between heat-dissipating surfaces

'adhes':9,13,20,38 'chemic':1 'compound':12 'conduct':19,37,48 'connect':45,57 'dissip':61 'epoxi':8 'establish':40,54 'filler':52 'fit':43 'forc':42 'force-fit':41 'gap':51 'general':16,24 'heat':60 'heat-dissip':59 'industri':4,17,25,32 'interfac':27 'materi':28 'name':7,35 'past':49 'pot':11 'remov':55 'scienc':6,34 'surfac':62 'thermal':18,26,36,44,47,56 'use':2,14,22,30

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