U.S. federal trademark · Serial No. 79087656 · Reg. No. 3953653
Ceramic compositions for use in high temperature applications comprised primarily of an insulating layer comprised of ceramic pastes, epoxy resins, polyimide resins, and phenol resins, in combination with aluminium and copper substrates; the aforementioned compositions for use in the manufacture of circuit boards; the aforementioned with or without fibre reinforcement and made out of a copper foil which is applied on the afore-mentioned insulation
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