U.S. federal trademark · Serial No. 90791129
Grinding, polishing, lapping, sawing and wire slicing machines; Grinding, polishing, lapping, sawing and slicing machines for processing semi-conductor wafers and substrates; Grinding, polishing, lapping, sawing and slicing machines for processing semi-conductor silicon carbide
Providing grinding, polishing, lapping, sawing and slicing services for semi-conductor wafers, substrates, and silicon carbide for others
Retail and online retail store services featuring silicon carbide
Source: USPTO federal trademark records. Informational only, not legal advice. Status and details may lag the live USPTO database.