U.S. federal trademark · Serial No. 86365431
Etching of integrated circuit and substrate wafers; manufacture of semiconductor packages in the nature of casings for semiconductors; wafer foundry, namely, integrated circuit foundry to the order and specification of others; wafer foundry, namely, manufacturing of semiconductor wafers for others; metal processing to the order and specification of others, namely, cutting metal, polishing metal, rust-resistant treatment on metal, soldering, welding, forging, tempering, plating, in particular, cadmium plating, chromium plating, gold plating, nickel plating, silver plating, tin plating; electroplating; forging of metal goods to the order and specification of others; applying decorative and protective coating to metal by means of galvanization; metal laminating; metal casting, blacksmithing; coppersmithing; metal treating, burnishing by abrasion; metal refining services, namely, gold, silver, copper, tin, nickel, stainless steel, steel, iron and metal alloy refining
Source: USPTO federal trademark records. Informational only, not legal advice. Status and details may lag the live USPTO database.