Semiconductor substrates supporting integrated power delivery; semiconductor package substrates incorporating power-distribution structures; silicon and silicon carbide substrates incorporating integrated power-routing structures; semiconductor substrates supporting power interconnects and heterogeneous integration; semiconductor substrates incorporating power-delivery networks, power-distribution layers, conductive routing structures, current-distribution pathways and power-integrity structures; semiconductor substrates for AI, HPC, communications, aerospace, defense, and heterogeneous semiconductor applications.

'aerospac':63 'ai':60 'applic':68 'carbid':18 'communic':62 'conduct':45 'current':49 'current-distribut':48 'defens':64 'deliveri':6,39 'distribut':13,43,50 'heterogen':32,66 'hpc':61 'incorpor':10,20,36 'integr':4,21,33,55 'interconnect':30 'layer':44 'network':40 'packag':8 'pathway':51 'power':5,12,23,29,38,42,54 'power-deliveri':37 'power-distribut':11,41 'power-integr':53 'power-rout':22 'rout':24,46 'semiconductor':1,7,26,34,57,67 'silicon':15,17 'structur':14,25,47,56 'substrat':2,9,19,27,35,58 'support':3,28

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