Semiconductor substrates incorporating integrated thermal-management structures; semiconductor substrates supporting heat spreading, heat transport, thermal routing and heat dissipation; silicon and silicon carbide substrates incorporating thermally conductive structures; semiconductor package substrates supporting integrated thermal management and heterogeneous integration; semiconductor substrates incorporating thermal-interface structures, heat-distribution pathways, thermal-routing structures and heat-spreading structures; semiconductor substrates for AI, HPC, communications, aerospace, defense, and advanced semiconductor packaging applications.

'advanc':69 'aerospac':66 'ai':63 'applic':72 'carbid':24 'communic':65 'conduct':28 'defens':67 'dissip':20 'distribut':49 'heat':12,14,19,48,57 'heat-distribut':47 'heat-spread':56 'heterogen':38 'hpc':64 'incorpor':3,26,42 'integr':4,34,39 'interfac':45 'manag':7,36 'packag':31,71 'pathway':50 'rout':17,53 'semiconductor':1,9,30,40,60,70 'silicon':21,23 'spread':13,58 'structur':8,29,46,54,59 'substrat':2,10,25,32,41,61 'support':11,33 'thermal':6,16,27,35,44,52 'thermal-interfac':43 'thermal-manag':5 'thermal-rout':51 'transport':15

QCIA THERMALFABRIC

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