QCP

Owners

Goods & Services

Custom fabrication of electronic and microelectronic systems, devices and components in the nature of interconnect device for microelectronic packaging, microelectronic device for die to die interconnect, microelectronic device for die stacking or stacking of microelectronic chips, microelectronic interposer device for connecting multiple semiconductor chips to microelectronic substrates, circuits for central processing units packaging, and circuits for high band width memory packaging, electronic data processing, automotive electronics, defense and military system electronics and consumer electronics

Research, design and development of technologies for the fabrication of electronic and microelectronic systems, devices and components in the nature of microelectronic packaging, patterning of microelectronic circuits on the chip, patterning of microelectronic circuits off the Chip and on the package device, patterning of microelectronic circuits off the Chip and on the interposer device, patterning of microelectronic circuits on main circuit board substrate, patterning of microelectronic circuits on mother board device, formation of a point to point omni directional electronic connection, formation of a point to point omni directional optical interconnect, and for fabrication of multilayer interconnect packaging device with fine feature and die stacking