material substrates processing for microelectronics, namely, splitting silicon carbide substrates between layers and cutting and polishing said split substrates

'carbid':9 'cut':14 'layer':12 'materi':1 'microelectron':5 'name':6 'polish':16 'process':3 'said':17 'silicon':8 'split':7,18 'substrat':2,10,19

microelectronic components, namely, semiconductor material substrates for use in flat screens, integrated optical wave guides, sensors and micro-machining

'compon':2 'flat':10 'guid':15 'integr':12 'machin':20 'materi':5 'micro':19 'micro-machin':18 'microelectron':1 'name':3 'optic':13 'screen':11 'semiconductor':4 'sensor':16 'substrat':6 'use':8 'wave':14

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