Non-abrasive polishing pads for chemical-mechanical planarizing or chemical mechanical polishing (cmp) machines for use in the manufacture of semiconductor wafers, glass substrates, and electronic circuit boards; polishing pads for polishing machines for use in the manufacture of semiconductor wafers, glass substrates, and electronic circuit boards; polishing pads being parts of machines for use in the manufacture of semiconductor wafers, glass substrates, and electronic circuit boards within the semiconductor industry; polishing pads being parts of machines for use in the manufacture of semiconductors within the semiconductor industry

'abras':3 'board':30,49,69 'chemic':8,12 'chemical-mechan':7 'circuit':29,48,68 'cmp':15 'electron':28,47,67 'glass':25,44,64 'industri':73,90 'machin':16,35,55,79 'manufactur':21,40,60,84 'mechan':9,13 'non':2 'non-abras':1 'pad':5,32,51,75 'part':53,77 'planar':10 'polish':4,14,31,34,50,74 'semiconductor':23,42,62,72,86,89 'substrat':26,45,65 'use':18,37,57,81 'wafer':24,43,63 'within':70,87

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