U.S. federal trademark · Serial No. 99528741 · Reg. No. 01856412
Custom manufacture of semiconductor wafers; Custom manufacturing of semiconductor components; Custom manufacture of semiconductor components; Custom manufacturing of integrated circuits for others; Etching; Etching services; Encapsulation of semiconductors; Metal treatment; Metal plating; Cutting of metals; Soldering; Die-casting of metals; Grinding; Laser engraving; Engraving; Burnishing by abrasion; Sorting of waste and recyclable material; Lithographic printing; Printing services; Treatment of materials by laser beam
Source: USPTO federal trademark records. Informational only, not legal advice. Status and details may lag the live USPTO database.