Custom manufacture of semiconductor wafers; Custom manufacturing of semiconductor components being wafers; Custom manufacture of semiconductor components being wafers; Custom manufacturing of integrated circuits for others; Etching, namely, etching of wafers and integrated circuits; Etching services, namely, etching of wafers and integrated circuits; Encapsulation of semiconductors; Metal treatment; Metal plating; Cutting of metals; Soldering; Die-casting of metals; Grinding; Laser engraving; Engraving; Sorting of waste and recyclable material; Lithographic printing; Printing services; Treatment of materials by laser beam, namely, laser scribing of wafers

'beam':79 'cast':57 'circuit':24,34,43 'compon':10,17 'custom':1,6,13,20 'cut':51 'die':56 'die-cast':55 'encapsul':44 'engrav':62,63 'etch':27,29,35,38 'grind':60 'integr':23,33,42 'laser':61,78,81 'lithograph':70 'manufactur':2,7,14,21 'materi':69,76 'metal':47,49,53,59 'name':28,37,80 'other':26 'plate':50 'print':71,72 'recycl':68 'scribe':82 'semiconductor':4,9,16,46 'servic':36,73 'solder':54 'sort':64 'treatment':48,74 'wafer':5,12,19,31,40,84 'wast':66

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