Chemicals for use in selective electroless metal deposition process for cladding of copper interconnects for integrated circuits, integrated circuit substrates, solar cells, flat panel displays, multi-chip modules, micro-electromechanical systems; chemicals for use in photo-selective metal deposition process to fabricate metal patterns in the manufacture of semiconductor and electronic devices; precision analytical chemicals for use in analysis of chemicals in selective electroless metal process

'analysi':62 'analyt':57 'cell':22 'chemic':1,34,58,64 'chip':28 'circuit':17,19 'clad':11 'copper':13 'deposit':8,42 'devic':55 'display':25 'electroless':6,67 'electromechan':32 'electron':54 'fabric':45 'flat':23 'integr':16,18 'interconnect':14 'manufactur':50 'metal':7,41,46,68 'micro':31 'micro-electromechan':30 'modul':29 'multi':27 'multi-chip':26 'panel':24 'pattern':47 'photo':39 'photo-select':38 'precis':56 'process':9,43,69 'select':5,40,66 'semiconductor':52 'solar':21 'substrat':20 'system':33 'use':3,36,60

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