Chemicals for use in high speed electrochemical metal plating process to produce thick copper interconnects for integrated circuits, integrated circuit substrates, solar cells, flat panel displays, multi-chip modules, micro-electromechanical systems; precision analytical chemicals for use in analysis of chemicals in high speed plating of interconnects

'analysi':41 'analyt':36 'cell':23 'chemic':1,37,43 'chip':29 'circuit':18,20 'copper':14 'display':26 'electrochem':7 'electromechan':33 'flat':24 'high':5,45 'integr':17,19 'interconnect':15,49 'metal':8 'micro':32 'micro-electromechan':31 'modul':30 'multi':28 'multi-chip':27 'panel':25 'plate':9,47 'precis':35 'process':10 'produc':12 'solar':22 'speed':6,46 'substrat':21 'system':34 'thick':13 'use':3,39

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