U.S. federal trademark · Serial No. 75262008 · Reg. No. 2241470
electrolytic and electroless plating equipment for materials other than aluminum, namely, electrolytic plating machines, electroless plating machines, semiconductor wafer cleaners, semiconductor wafer photoresist removers, electrolytic passivation machines for use in plating applications, electrochemical planarization machines as used in semiconductor wafer processing, and chemical distribution units
Source: USPTO federal trademark records. Informational only, not legal advice. Status and details may lag the live USPTO database.