Low Pressure/Low Temperature Injection Molding Of Electronics, Circuit Boards, Electrical And Electromechanical Assemblies To The Order And Specification Of Others; Material Treatment Services To The Order And/Or Specifications Of Others, Namely, Providing Potting And Encapsulation Of Electronics

'and/or':27 'assembl':13 'board':9 'circuit':8 'electr':10 'electromechan':12 'electron':7,37 'encapsul':35 'inject':4 'low':1 'materi':21 'mold':5 'name':31 'order':16,26 'other':20,30 'pot':33 'pressure/low':2 'provid':32 'servic':23 'specif':18,28 'temperatur':3 'treatment':22

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