EQUIPMENT, COMPONENTS, DEVICES, PRODUCTS AND SYSTEMS THEREOF FOR ELECTRONIC, SEMI-CONDUCTOR, PHARMACEUTICAL, PACKAGE, BIOTECH, AEROSPACE AND AUTOMOTIVE INDUSTRIES; NAMELY EQUIPMENT, DEVICES AND SYSTEMS THEREOF FOR VISION AND AUTOMATIC IDENTIFICATION FOR WAFERS, ELECTRONIC COMPONENTS, CIRCUITS, AND PC BOARDS, PACKAGES, DEVICE LEADS, GRID ARRAYS, BALL PLACEMENT, TAPE AND REEL COMPONENT PROCESSING, IMAGING, TRAY TO TAPE, 1-D AND 2-D DATA COLLECTION AND BAR-CODE AND MATRIX CODE IMAGING, READING, AND DECODING AS WELL AS COMPONENTS, PROGRAMS AND SOFTWARE AND FIRMWARE THEREFORE-ALL

'1':55 '2':58 'aerospac':16 'array':43 'automat':29 'automot':18 'ball':44 'bar':64 'bar-cod':63 'biotech':15 'board':38 'circuit':35 'code':65,68 'collect':61 'compon':2,34,49,76 'conductor':12 'd':56,59 'data':60 'decod':72 'devic':3,22,40 'electron':9,33 'equip':1,21 'firmwar':81 'grid':42 'identif':30 'imag':51,69 'industri':19 'lead':41 'matrix':67 'name':20 'packag':14,39 'pc':37 'pharmaceut':13 'placement':45 'process':50 'product':4 'program':77 'read':70 'reel':48 'semi':11 'semi-conductor':10 'softwar':79 'system':6,24 'tape':46,54 'therefor':83 'therefore-al':82 'thereof':7,25 'tray':52 'vision':27 'wafer':32 'well':74

PROVIDING DESIGN, OPERATION AND SERVICING OF SAME

'design':2 'oper':3 'provid':1 'servic':5

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