U.S. federal trademark · Serial No. 73395534 · Reg. No. 1291930
Ceramic Micro-Electronic Packaging Structural Components-Namely, Ceramic Multi-Layer Semi-Conductor Packages, Glass Sealed Semi-Conductor Packages, Dual-in-Line Packages, Flat Packs, Leaded Chip Carriers, Leadless Chip Carriers, Hybrid Packages and Standard Substrates
Source: USPTO federal trademark records. Informational only, not legal advice. Status and details may lag the live USPTO database.