Trademark Search  /  SEED

SEED

● Live · Registered

U.S. federal trademark · Serial No. 90254529 · Reg. No. 7001086

Mark
SEED
Status
Registered
Serial Number
90254529
Registration No.
7001086
Filing Date
October 14, 2020
Registration Date
March 14, 2023
Class(es)
Class 006

Owners

NIPPON DENKAI, LTD.
22 · TOKYO, JP
Nippon Denkai, Ltd.
99 · Chikuseishi Ibarakiken, JP
Nippon Denkai, Ltd.
99 · Chikuseishi Ibarakiken, JP
Nippon Denkai, Ltd.
99 · Chikuseishi Ibarakiken, JP

Goods & Services

Common metals in foil form for use in the manufacture of batteries, flexible printed circuits, and wiring boards; common metals in foil form for use in further manufacturing; unwrought and semi-wrought copper in foil form for use in the manufacture of batteries, flexible printed circuits, and wiring boards; unwrought and semi-wrought copper in foil form for use in further manufacturing

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Source: USPTO federal trademark records. Informational only, not legal advice. Status and details may lag the live USPTO database.