SHB2 NANO

Owner

Goods & Services

Bonding machine for semiconductor processing; machines for assembling semiconductor components; die bonder for semiconductor manufacturing; electronic chip assembly and packaging device for semiconductor manufacturing; flip-chip bonder for semiconductor manufacturing; hybrid bonder for semiconductor manufacturing; semiconductor processing machines; apparatus for manufacturing semiconductors; cluster tool integration platform for integrated circuit and semiconductor device manufacturing; cluster tool integration platform for manufacturing integrated circuits and semiconductor devices including a hybrid bonder; integrated tool for performing hybrid bonding chip packaging technology (semiconductor wafer processing equipment); integrated platform for cluster tools used in the manufacturing of integrated circuits and semiconductor devices for hybrid bonding chip packaging technology.