Repair or maintenance of integrated circuit manufacturing machines and systems; repair or maintenance of semiconductor manufacturing machines and systems

'circuit':6 'integr':5 'machin':8,17 'mainten':3,13 'manufactur':7,16 'repair':1,11 'semiconductor':15 'system':10,19

Semiconductor manufacturing machines and systems comprised of die-bonders, wire bonders, chip on film bonders, flip chip bonders, bump bonders, discreet assemblers, package sorters, tape bonders and die transferring machines

'assembl':23 'bonder':10,12,16,19,21,27 'bump':20 'chip':13,18 'compris':6 'die':9,29 'die-bond':8 'discreet':22 'film':15 'flip':17 'machin':3,31 'manufactur':2 'packag':24 'semiconductor':1 'sorter':25 'system':5 'tape':26 'transfer':30 'wire':11

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