Semiconductor components, namely, semiconductor components with electromagnetic shielding in the form of a metallic coating covering the top and sides of a packaging material encapsulating a semiconductor element to form a Faraday cage around the packaging material; semiconductor components, namely, semiconductor devices with electromagnetic shielding in the form of a metallic coating covering the top of a packaging material encapsulating a semiconductor element, where the packaging material includes wire bonding fencing that electrically connects to the metallic coating to form a Faraday cage around the packaging material

'around':34,84 'bond':70 'cage':33,83 'coat':15,52,78 'compon':2,5,39 'connect':74 'cover':16,53 'devic':42 'electr':73 'electromagnet':7,44 'element':28,63 'encapsul':25,60 'faraday':32,82 'fenc':71 'form':11,30,48,80 'includ':68 'materi':24,37,59,67,87 'metal':14,51,77 'name':3,40 'packag':23,36,58,66,86 'semiconductor':1,4,27,38,41,62 'shield':8,45 'side':20 'top':18,55 'wire':69

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