U.S. federal trademark · Serial No. 98744832
New product development services for others, namely, custom engineering, design, and testing of new products, namely, semiconductors and integrated circuits; technology consultation services regarding semiconductors and integrated circuits; new product development services for others, namely, custom engineering, design, and testing of new products, namely, semiconductors and integrated circuits in the fields of semiconductor wafer bonding, semiconductor die bonding, and wafer-level packaging of semiconductors; technology consultation services regarding semiconductors and integrated circuits in the fields of semiconductor wafer bonding, semiconductor die bonding, and wafer-level packaging of semiconductors
Custom manufacture of semiconductors and integrated circuits; custom manufacture of semiconductors in the field of semiconductor wafer bonding; custom manufacture of semiconductors in the field of semiconductor die bonding; Custom manufacture of integrated circuits for others, namely, wafer-level packaging of semiconductors
Source: USPTO federal trademark records. Informational only, not legal advice. Status and details may lag the live USPTO database.