SMARTCLEAVE

Owners

Goods & Services

Technical consultancy relating to manufacturing methods and devices in the field of semi-conductor technology; research and development relating to manufacturing methods and devices in the field of semi-conductor technology; technical project planning relating to manufacturing methods and devices in the field of semi-conductor technology; Contract research and contract development, for others, in particular in the fields of micro-systems engineering, micro-mechanics, sensor technology, dosing technology, automation engineering, function and reliability testing, wafer technology, medical technology, time measuring technology and software; scientific research and custom design for others in the field of semiconductors, semiconductor systems, wafers and integrated circuits, semiconductor packages, semiconductor testing devices, semiconductor handling and storage devices; Design and Development of Computer hardware and Software

Machines and apparatus for the severing, production, alignment, adjustment, linking, coating, development, cleaning, printing, lithographic treatment, in particular nanostructure imprinting, hot stamping, micro-contact printing, testing, and manufacturing of electronic circuits and semiconductors, in particular transistors and wafers; parts and equipment for machines and apparatus for the severing, production, alignment, adjustment, linking, coating, development, cleaning, printing, lithographic treatment, in particular nanostructure imprinting, hot stamping, micro-contact printing, testing, and manufacturing of electronic circuits and semiconductors, in particular, transistors and wafers; installations for processing semiconductors, namely, severing a substrate, in particular for processing semiconductors under vacuum; installations for conveying semiconductors, namely, belt conveyors; installations and systems for the surface treatment of semiconductors, namely, removal of oxides from surfaces, in particular through sputtering; installations and systems for etching semiconductor surfaces comprising plasma generating parts; installations for vaporising semiconductor surfaces, in particular under vacuum (CVD processes); installations for conveying, providing, and processing semiconductors, namely, apparatuses containing robot arms for wafer transport; installations for conveying, processing, and providing flat screens, namely, imprint apparatuses; machines and turnkey production installations for manufacturing semiconductor components from the semiconductor backend sector and for manufacturing light diodes; machines for semiconductor manufacturing; machines for memory and microcontroller chip manufacturing and memory and microcontroller chip assembly