U.S. federal trademark · Serial No. 98531412 · Reg. No. 40-2246281
Semiconductor component, namely, ceramic substrate being a heat sink for semiconductors with heat dissipation function; heat sinks for semiconductor elements; Heat dissipation substrate, namely, metalized ceramic substrate being a heat sink for semiconductors, used for heat dissipation of semiconductor chips; Heat dissipation substrate, namely, metalized ceramic substrate being a heat sink for iintegrated circuits, used for heat dissipation of integrated circuits
Design of semiconductors; design of semiconductors or integrated circuits; research in the area of semiconductor processing technology
Source: USPTO federal trademark records. Informational only, not legal advice. Status and details may lag the live USPTO database.