Substrates for semi-conductors; glazed substrates for thermal printer heads; polyimide thin film multilayer substrates for semi-conductors; integrated circuit packages for semi-conductors; chip packages; crystal resonator SAW(Surface Acoustic Wave) filter package; leadless chip carriers; interposers for semi-conductors; printed circuit boards; flexible printed circuit boards; printed wiring boards; pin grid arrays chip packages; ball grid array chip packages; aluminum nitride products and cerdips, namely, ceramic packages or substrates used in the manufacture of integrated circuits; printed circuits; printed wiring; multilayer printed circuit board

'acoust':34 'aluminum':66 'array':58,63 'ball':61 'board':48,52,55,90 'carrier':40 'ceram':72 'cerdip':70 'chip':28,39,59,64 'circuit':22,47,51,82,84,89 'conductor':5,20,27,45 'crystal':30 'film':14 'filter':36 'flexibl':49 'glaze':6 'grid':57,62 'head':11 'integr':21,81 'interpos':41 'leadless':38 'manufactur':79 'multilay':15,87 'name':71 'nitrid':67 'packag':23,29,37,60,65,73 'pin':56 'polyimid':12 'print':46,50,53,83,85,88 'printer':10 'product':68 'reson':31 'saw':32 'semi':4,19,26,44 'semi-conductor':3,18,25,43 'substrat':1,7,16,75 'surfac':33 'thermal':9 'thin':13 'use':76 'wave':35 'wire':54,86

SOLDER COLUMN INTERPOSER

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