U.S. federal trademark · Serial No. 76076821 · Reg. No. 2590575
Assembly, encapsulation, encasing of integrated circuits/silicon die; turn key services, namely, custom manufacture and assembly of integrated circuits
Electrical and electronic components, namely, semi-conductors, semi-conductor chips; integrated circuits, integrated packages and integrated circuits chips; parts and fittings for all the aforesaid goods
Testing, analysis, wafer probe, wafer sort, probing and testing, final testing, design of electrical and electronic components, semi-conductors, semi-conductor chips, integrated circuits, integrated circuits, integrated packages and integrated circuit chips; research and development services, relating to the aforesaid; information, advice and consultation in relation to all the aforesaid services
Source: USPTO federal trademark records. Informational only, not legal advice. Status and details may lag the live USPTO database.