Metal clad laminates for non-circuit applications, namely, for packaging, shielding, wrapping, structuring; metal clad laminates for Circuit laminates, namely, metalized laminates for use in the manufacturing of printed circuit boards, speaker coils and antennas

'antenna':36 'applic':8 'board':32 'circuit':7,19,31 'clad':2,16 'coil':34 'lamin':3,17,20,23 'manufactur':28 'metal':1,15,22 'name':9,21 'non':6 'non-circuit':5 'packag':11 'print':30 'shield':12 'speaker':33 'structur':14 'use':25 'wrap':13

Specialty non-metal laminates, namely, for packaging, chemical and thermal protection, chemical barrier used in harsh or demanding environments; non-metal clad laminates for Circuit laminates, namely, non-metal laminates for use in the manufacturing of printed circuit boards; non-metal coverfilm and bondply for use in manufacturing of electronic circuitry and as protection layer for packaging, chemical and thermal protection, in roll or sheet form

'barrier':14 'board':42 'bondpli':48 'chemic':9,13,62 'circuit':27,41 'circuitri':55 'clad':24 'coverfilm':46 'demand':19 'electron':54 'environ':20 'form':70 'harsh':17 'lamin':5,25,28,33 'layer':59 'manufactur':38,52 'metal':4,23,32,45 'name':6,29 'non':3,22,31,44 'non-met':2,21,30,43 'packag':8,61 'print':40 'protect':12,58,65 'roll':67 'sheet':69 'specialti':1 'thermal':11,64 'use':15,35,50

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