LOW PRESSURE/LOW TEMPERATURE INJECTION MOLDING OF ELECTRONIC, WIRE, CABLE, ELECTRICAL AND ELECTROMECHANICAL ASSEMBLIES TO THE ORDER AND SPECIFICATION OF OTHERS; CUSTOMIZED MATERIAL TREATMENT SERVICES TO THE ORDER AND/OR SPECIFICATIONS OF OTHERS, NAMELY, PROVIDING POTTING AND ENCAPSULATION SERVICES; CONFORMAL COATING SERVICES; SEALING AND GASKETING SERVICES; THERMAL MANAGEMENT MATERIAL APPLICATION SERVICES; EMI/RFI SHIELDING SERVICES; BONDING SERVICES IN THE FIELDS OF ADHESIVES, SEALANTS AND ELECTRONICS; ASSEMBLY OF ELECTRICAL, ELECTROMECHANICAL AND MECHANICAL PRODUCTS TO THE ORDER AND SPECIFICATION OF OTHERS

'adhes':59 'and/or':28 'applic':48 'assembl':13,63 'bond':53 'cabl':9 'coat':39 'conform':38 'custom':21 'electr':10,65 'electromechan':12,66 'electron':7,62 'emi/rfi':50 'encapsul':36 'field':57 'gasket':43 'inject':4 'low':1 'manag':46 'materi':22,47 'mechan':68 'mold':5 'name':32 'order':16,27,72 'other':20,31,76 'pot':34 'pressure/low':2 'product':69 'provid':33 'seal':41 'sealant':60 'servic':24,37,40,44,49,52,54 'shield':51 'specif':18,29,74 'temperatur':3 'thermal':45 'treatment':23 'wire':8

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