U.S. federal trademark · Serial No. 98261083 · Reg. No. 02394347
Crystal wafer etching treatment; Semiconductor sealing processing; Integrated circuit etching treatment; Wafer Foundry, namely, manufacture of semiconductor wafers for others; Metal cutting treatment; Metal polishing treatment; Metal forging treatment; Metal tempering; Metal rust-resistant treatment; Metal plating; Cadmium plating; Chromium plating; Galvanization; Gold plating; Nickel plating; Silver plating; Tin plating; Electroplating; Laminating of metal plates and plastic sheets; Metal casting; Blacksmithing; Metal welding treatment; Welding services; Metal treating; Grinding; Burnishing by abrasion; Refining services, namely, refining of metals; Custom manufacturing of semi-conductors, chips and integrated circuits
Inspection and test of product quality; Providing product research and development; Product research; Technological research in the field of thick film substrates and customized semiconductor micro-module packaging; Conducting technical project studies in the field of thick film substrates and customized semiconductor micro-module packaging; Industrial analysis and research service in the field of packaging services and substrate manufacturing technologies; Scientific laboratory services; Custom design and testing for new product development
Source: USPTO federal trademark records. Informational only, not legal advice. Status and details may lag the live USPTO database.