METAL-BASED INDUSTRIAL MATERIALS, NAMELY, LEAD-FREE SOLDER AND LEAD-FREE SOLDER ALLOYS FOR USE IN INDUSTRIAL APPLICATIONS, NAMELY, MANUFACTURE AND PROCESSING OF PRINTED CIRCUIT BOARDS AND OTHER ELECTRONIC SUBSTRATES

'alloy':16 'applic':21 'base':3 'board':29 'circuit':28 'electron':32 'free':9,14 'industri':4,20 'lead':8,13 'lead-fre':7,12 'manufactur':23 'materi':5 'metal':2 'metal-bas':1 'name':6,22 'print':27 'process':25 'solder':10,15 'substrat':33 'use':18

HIGH-PERFORMANCE MACHINERY AND SYSTEMS FOR ELECTRONICS APPLICATIONS EMPLOYING LEAD-FREE MATERIALS TO MANUFACTURE LEAD-FREE PRINTED CIRCUIT BOARDS AND OTHER ELECTRONIC SUBSTRATES, NAMELY, MATERIALS DISPENSING MACHINES, STENCIL PRINTING MACHINES, FLUXING MACHINES, REFLOW SOLDERING MACHINES, WAVE-SOLDERING MACHINES, AND FLUX REMOVAL/CLEANING MACHINES

'applic':9 'board':22 'circuit':21 'dispens':29 'electron':8,25 'employ':10 'flux':34,44 'free':13,19 'high':2 'high-perform':1 'lead':12,18 'lead-fre':11,17 'machin':30,33,35,38,42,46 'machineri':4 'manufactur':16 'materi':14,28 'name':27 'perform':3 'print':20,32 'reflow':36 'removal/cleaning':45 'solder':37,41 'stencil':31 'substrat':26 'system':6 'wave':40 'wave-sold':39

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