U.S. federal trademark · Serial No. 79229289 · Reg. No. 5645971
Cutting machines; cutting machines for working with abrasive wires; cutting machines for processing semiconductor wafers; abrasive wires being parts of machines; abrasive wires for semiconductor wafer cutting being parts of machines; abrasive wires for ceramic material cutting being parts of machines; abrasive wires for sapphire cutting being parts of machines; abrasive wires for silicon carbide cutting being parts of machines; abrasive wires for quartz cutting being parts of machines; abrasive wires for silicon nitride cutting being parts of machines; abrasive wires for aluminum nitride cutting being parts of machines; semiconductor cutting machines; equipment for processing semi-conductor wafers
Abrasive wires of metal; abrasive wires with metal core and having at least one abrasive particle layer
Cutting of materials by abrasion; cutting of metals by abrasion; cutting of materials by means of abrasive wires
Source: USPTO federal trademark records. Informational only, not legal advice. Status and details may lag the live USPTO database.