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UCSP

○ Dead · Abandoned

U.S. federal trademark · Serial No. 78141122

Mark
UCSP
Status
Abandoned
Serial Number
78141122
Filing Date
July 3, 2002
Class(es)
Class 009

Owners

FLIP CHIP TECHNOLOGIES, LLC
03 · Phoenix, AZ
Kulicke & Soffa Investments Inc.
03 · Wilmington, DE, US
Kulicke & Soffa Investments Inc.
03 · Wilmington, DE, US

Goods & Services

SEMICONDUCTOR PACKAGING FOR MANUFACTURERS OF SEMICONDUCTORS AND DEVICES UTILIZING SEMICONDUCTORS, NAMELY, UNDER BUMP METALIZATION, POLYMER THIN FILM LAYERS AND SOLDER BUMPS CONSTRUCTED ON SEMICONDUCTOR WAFER TO PROTECT THE INTEGRATED CIRCUIT FROM CONTAMINANTS AND MOISTURE AND TO MAKE AN ELECTRICAL CONNECTION BETWEEN THE INTEGRATED CIRCUIT CHIP AND PRINTED CIRCUIT BOARD OR OTHER SUBSTRATES

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Source: USPTO federal trademark records. Informational only, not legal advice. Status and details may lag the live USPTO database.