U.S. federal trademark · Serial No. 73227313 · Reg. No. 1195554
Modular Packaging System for Assembling and Housing Experimental, Prototype and Production of Electrical and Electronic Products for Developmental, Industrial and Original Equipment Manufacturing Applications, and Comprising, Molded Thermoplastic Enclosure Panels, Epoxy Glass Gridboard Circuit Boards, Transparent Window Panels, and Mounting Feet
Source: USPTO federal trademark records. Informational only, not legal advice. Status and details may lag the live USPTO database.