Trademark Search  /  UNOVIS

UNOVIS

○ Dead · Cancelled

U.S. federal trademark · Serial No. 77006230 · Reg. No. 3402369

Mark
UNOVIS
Status
Cancelled
Serial Number
77006230
Registration No.
3402369
Filing Date
September 25, 2006
Registration Date
March 25, 2008
Class(es)
Class 007, Class 009, Class 040, Class 042

Owners

Universal Instruments Corporation
03 · Binghamton, NY, US
Universal Instruments Corporation
03 · Binghamton, NY, US
Universal Instruments Corporation
03 · Binghamton, NY, US

Goods & Services

Electronics assembly machines that complement and enhance standard surface mount equipment for the automotive, component assembly, telecommunications, and medical markets, namely, semiconductor manufacturing machines, component and printed circuit board assembly machines in the nature of manufacturing machines for performing one or more of the following functions, namely, orienting, feeding, mounting and bonding electronic semiconductor components together and onto printed circuit boards, semiconductor wafer processing machines and semiconductor substrates manufacturing machines; semiconductor manufacturing machines featuring component and die feeders, conveyors, process peripherals and flexible process cells; semiconductor manufacturing machines for use in flip chip and die bonding, hybrid module assembly, and mechanical assembly utilizing surface mount and insertion mount equipment

Electrical controllers and computer software for use in controlling electronics and semiconductor component assembly machines, all for use by customers in the automotive, component assembly, telecommunications, and medical markets; computer software for determining optimum processes for assembling electronics and semiconductor components, for use by customers in the automotive, component assembly, telecommunications, and medical markets; computer based apparatus for designing the layout of electronic circuits; electrical controllers and computer software for use in controlling semiconductor manufacturing machines that perform flip chip and die bonding, hybrid module assembly, and mechanical assembly utilizing surface mount and insertion mount equipment

Consulting for others in the field of electronics assembly and processes for assembling semiconductor components; providing information to others in the field of electronics and semiconductor component assembly related to flip chip and die bonding, hybrid module assembly, and mechanical assembly

Research and development in the field of surface mount and insertion mount electronics assembly equipment; engineering services in the field of electronics assembly equipment for customers in the automotive, semiconductor component assembly, telecommunications, and medical markets; design, development and testing of new products for others in the field of electronics assembly equipment

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Source: USPTO federal trademark records. Informational only, not legal advice. Status and details may lag the live USPTO database.