URUSHI

Owner

Goods & Services

Processing of semiconductor wafers; surface grinding of semiconductor wafers; metal treatment of semiconductor wafers; water treatment of semiconductor wafers; material treatment of semiconductor wafers.

Protective sheets and films for semiconductor wafer surfaces; releasing sheets and films for releasing protective sheets for semiconductor wafer surfaces; adhesive tapes for processing semiconductors and electronic components used in the manufacture of semiconductor wafers and electronic components; adhesive tapes, other than stationery and not for medical or household purposes.

Liquid chemicals for forming protective films on the surface of semiconductor wafers; chemicals for removing protective films formed on the surface of semiconductor wafers; chemicals for releasing protective films formed on the surface of semiconductor wafers; industrial chemicals.

Metalworking machines and tools; semiconductor manufacturing machines; dicing equipment for cutting semiconductor wafers into chips; laser processing equipment for manufacturing semiconductors; equipment for grinding semiconductor wafers; equipment for cleaning semiconductor wafers; plasma etching equipment for semiconductor wafers; equipment for forming protective films for semiconductor wafers; equipment for removing protective films for semiconductor wafers.