U.S. federal trademark · Serial No. 97252047 · Reg. No. 6859492
Chemical used in metallization of circuit boards and integrated chips; direct metallization chemicals for use in high-density printed circuit boards; chemicals used in the manufacture of high density interconnect circuitry; chemicals used in metallization of printed circuit board substrates
Source: USPTO federal trademark records. Informational only, not legal advice. Status and details may lag the live USPTO database.