U.S. federal trademark · Serial No. 98741387 · Reg. No. 02377517
Etching process of semiconductor wafer; semiconductor packaging processing in the nature of custom manufacture of semiconductor packaging being semiconductor dies and interconnects, semiconductor chip housings, semiconductor integrated circuit modules; etching processing being etching of integrated circuits; semiconductor wafer-level processing, namely, custom manufacture of semiconductor wafers; wafer foundry, namely, custom manufacture of semiconductor wafers; integrated circuit packaging processing in the nature of custom manufacture of integrated circuit packaging; custom manufacture of substrates, semiconductors, integrated circuits, integrated circuit boards, and wafers to the order and specification of others
Technology research and development for others in the field of semiconductor related product; integrated circuits design; semiconductor packaging design; substrate design; quality inspection for semiconductors and the related products; testing of semiconductors and the related products; quality identification for semiconductors and the related products, namely, quality control inspection of semiconductors and related products; consulting with respect to semiconductor packaging technology, namely, consulting regarding semiconductor packaging design and development
Source: USPTO federal trademark records. Informational only, not legal advice. Status and details may lag the live USPTO database.