HEAT DISSIPATION COMPONENTS FOR ELECTRONICS, NAMELY, HEAT SINKS AND FANS FOR USE WITH MICROPROCESSORS, INTEGRATED CIRCUITS, AND APPLICATION-SPECIFIC INTEGRATED CIRCUITS (ASICS); CUSTOM MANUFACTURE OF HEAT DISSIPATION COMPONENTS, HEAT DISSIPATION ASSEMBLIES, AND HEAT DISSIPATION SYSTEMS FOR OTHERS; AND, ENGINEERING SERVICES, NAMELY, DESIGN AND ANALYSIS OF HEAT DISSIPATION COMPONENTS, HEAT DISSIPATION ASSEMBLIES, AND HEAT DISSIPATION SYSTEMS FOR OTHERS

'analysi':45 'applic':19 'application-specif':18 'asic':23 'assembl':32,52 'circuit':16,22 'compon':3,29,49 'custom':24 'design':43 'dissip':2,28,31,35,48,51,55 'electron':5 'engin':40 'fan':10 'heat':1,7,27,30,34,47,50,54 'integr':15,21 'manufactur':25 'microprocessor':14 'name':6,42 'other':38,58 'servic':41 'sink':8 'specif':20 'system':36,56 'use':12

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