U.S. federal trademark · Serial No. 85002128 · Reg. No. 4060813
Thermal extrusions and heat sinks for printed circuit boards, namely, high density extrusions, bonded heat sinks, stack and swage fins, folded fin, DC/DC converter, printed circuit board levels, BGA/PGA heat sinks for computers, microprocessor heat sinks, and cold plates and conduction-cooled heat frames for printed circuit boards
Source: USPTO federal trademark records. Informational only, not legal advice. Status and details may lag the live USPTO database.